CALIFORNIA INSTITUTE OF TECHNOLOGY
MICROMACHINING LABORATORY
  Research
   
  2005   2004   2003   2002   2001   Research Sponsors   Research Areas

2005 Highlights Back to the top 

2004 Highlights Back to the top

2003 Highlights Back to the top

Pictures of a mixer, shear stress sensor, microchannels, M3 chip, flex skin, electret microphone, shear stress imager and magnetic mirror

2002 Highlights Back to the top

2001 Highlights Back to the top

Pictures of a bellow, microbat, micro hard disk drive suspension motor, hotwire anemometer, permalloy actuator, neurochip, balloon, and ballon for microvalve applications

Research Sponsors

DARPA, AFOSR, ARO, ONR, NASA, JPL, NSF (PYI Award), NIH, Packard and Lucile Foundation (Packard Fellowship), HP, GM, Seagate, Rockwell International, Medtronics, Topomatrix, Xerox, BEI, and NSIC/DARPA.

Research Areas  Back to the top 
MEMS Technologies/Capabilities MEMS Materials
  • LPCVD of SiN, LTO, PSG, Polysilicon
  • PECVD of SixNy
  • CVD of Parylene
  • Spin on of photoresist, Teflon, polyimide
  • Electroplating of NiFe, Au, Cu, Ni
  • Evaporation of Al, Cu, Cr, Ti, Au
Sensors
Microstructures MEMS Systems MEMS Science Actuators
 


home | research | people | facility | courses | admission | publications | links         © 2006 California Institute of Technology

ALL RIGHTS RESERVED