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2005 2004 2003 2002 2001 Research Sponsors Research Areas
2005 Highlights Back to the top
2004 Highlights Back to the top
2003 Highlights Back to the top

2002 Highlights Back to the top
2001 Highlights Back to the top

Research Sponsors
DARPA, AFOSR, ARO, ONR, NASA, JPL, NSF (PYI Award), NIH, Packard and Lucile
Foundation (Packard Fellowship), HP, GM, Seagate, Rockwell International,
Medtronics, Topomatrix, Xerox, BEI, and NSIC/DARPA.
Research Areas Back to the top
MEMS
Technologies/Capabilities
MEMS Materials
- LPCVD of SiN, LTO, PSG, Polysilicon
- PECVD of SixNy
- CVD of Parylene
- Spin on of photoresist, Teflon, polyimide
- Electroplating of NiFe, Au, Cu, Ni
- Evaporation of Al, Cu, Cr, Ti, Au
Sensors
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Microstructures
MEMS Systems
MEMS Science
Actuators
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