Caltech Micromachining Laboratory
Selective Disposition of Parylene-C for Underwater Shear-Stress Sensors
Project Abstract
The deposition rate of parylene varies with the temperature of
substrates. This property is utilized to selectively deposit
parylene C on underwater shear-stress sensors by electrically heating
the sensing element during deposition. Due to the sensor’s excellent
thermal isolation, only very small power is needed and the substrate
temperature increase is minimized during deposition. After selective
parylene deposition, the sensing element is still exposed while other
areas are covered by parylene. More effective interaction between the
sensor and water is realized. With selective parylene deposition,
excellent waterproof and high shear-stress sensitivity can be achieved
at the same time.
References
Y. Xu and Y.C. Tai,"Selective Deposition of Parylene C for Underwater Shear-stress Sensors," Technical Digest, The 12th
International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers '03), Boston, USA, pp. 1307-1310 (2003).
Involved Personnel
Yong Xu, Yu-Chong Tai