Caltech Micromachining Laboratory Robust Parylene-to-Silicon Mechanical Anchoring

Project Abstract

This paper describes a new technique for strongly anchoring parylene (poly-para-xylylene) layers on a silicon substrate. Parylene has gained interest for MEMS applications due to its excellent properties. More specifically, because of its flexibility (Yong’s modulus =4GPa), its chemical barrier properties, its conformal deposition and its biocompatibility, parylene is of great interest for microfluidics and BioMEMS. One of the issues with parylene processing is adhesion and delamination problems, occurring during fabrication or during device operation. Here, we report a new technique for anchoring parylene films on silicon using DRIE-etched trenches and anchors. We demonstrate a new way to completely protect the adhesion of parylene even when exposed to aggressive chemicals.

References

M. Liger, D. Rodger and Y.C. Tai, "Robust Parylene-to-Silicon Mechanical Anchoring," Proceedings, The Sixteenth IEEE International Conference on Micro Electro Mechanical Systems (MEMS '03), Kyoto, Japan, Jan. 19-23, pp. 602-605, (2003).

Involved Personnel

Matthieu Liger, Damien C. Rodger, Yu-Chong Tai

Related Publications

  • T. Harder et al “Residual Stress in Parylene C” Proceedings of the 15th IEEE International Conference on Micro Electro Mechanical Systems (MEMS '02) pp. 435-438.

  • X. Q. Wang, Q. Lin, and Y. -C. Tai, “A Parylene Micro Check Valve,” Proceedings of the 12th IEEE International Conference on Micro Electro Mechanical Systems, (MEMS '99) Florida, U.S.A, Jan. 17-21, 1999, pp. 177-182.

  • M. Liger, N. Pornisin-Sirirak, S. Ho, C.M. Ho and Y.C. Tai “Large-Area Electrostatic-Valved Skins for Adaptive Flow Control on Ornithopter Wings”. Solid State Sensor, Actuator, and Microsystems Workshop, Hilton Head Island South Carolina June 2-6 2002 pp. 247-250.

  • Qing He, Jun Xie (Caltech Micromachining Group), personal communication.